Workpiece dia.................................up to 155 mm Maximum length of workpiece........650 mm Horizontal orientation .....................+/- 7degrees Vertical orientation .........................+/- 7degrees Index infinitely adjustable from.......0 - 14 mm Smallest index step........................ 0.001mm Feedrate infinitely variable ........... 3 - 200 mm/min
This Meyer Burger TS-23 ID Slicing Saw is the most efficient way to slice various ingots to wafers such as slicing SiC, Sapphire, InP, GaP, GaAs, Gasb, GaN and R&D substrates as well as cutting glass, magnetic, optical and ceramic, Quartz, microelectronics and Solar materials.
It uses an anular blade to give highly accurate slicing or cutting with minimal kurf losses, which is extremely cost effective with high value materials and it offers very good yields. It can cut ingots into wafers with Bow. The anular saw TS-23 is especially designed for fully automatic slicing of hard and brittle ingots and other materials such as Saphire, GaAs, InP, GaP, InSb GaSb, Silicon and other ingots into wafers. It also can slice glass, magnetic, optical and ceramic materials. It can be automatically loaded 4 25pc-cassettes with total 100 pc wafers each time.
This machine also offers high accuracy, simple and reliable conception, easy operation and maintenance.
If you have any questions in the equipment, please contact sales@used-se.com for details:
Used Semiconductor Equipment, AGMG 29430 Union City Blvd. Union City, CA 94587 510-675-9793 (Main) 510-803-5066 (Fax) 510-567-4498 (Direct) sales@used-se.com
